IPC-2152 Equation:
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The IPC-2152 standard provides guidelines for determining the current carrying capacity of printed circuit board (PCB) traces. This equation calculates the maximum current a trace can carry based on its width and the allowable temperature rise.
The calculator uses the IPC-2152 equation:
Where:
Explanation: The equation accounts for the relationship between trace width, temperature rise, and the maximum current the trace can safely carry without overheating.
Details: Proper current carrying capacity calculation is crucial for PCB design to prevent trace overheating, ensure reliability, and meet safety standards in electronic circuits.
Tips: Enter trace width in mils (1 mil = 0.001 inch) and desired temperature rise in °C. All values must be valid (width > 0, temperature rise > 0).
Q1: What is the IPC-2152 standard?
A: IPC-2152 is a standard that provides guidelines for determining current carrying capacity in printed board design, replacing the older IPC-2221 guidelines.
Q2: How accurate is this calculation?
A: The equation provides a good estimate, but actual performance may vary based on copper thickness, board material, and environmental conditions.
Q3: What is a typical temperature rise for PCB traces?
A: Typical temperature rises range from 10°C to 30°C, depending on the application and safety requirements.
Q4: Does copper thickness affect current carrying capacity?
A: Yes, this calculation assumes standard 1 oz/ft² copper (approximately 1.4 mils thick). Thicker copper can carry more current.
Q5: Are there other factors that affect current capacity?
A: Yes, including ambient temperature, board material, presence of solder mask, and whether the trace is internal or external to the board.