IPC-2221 Formula:
From: | To: |
The IPC-2221 formula calculates the current carrying capacity of PCB copper traces based on temperature rise and cross-sectional area. It provides a standardized method for determining safe current limits in printed circuit board design.
The calculator uses the IPC-2221 formula:
Where:
Explanation: The formula accounts for the relationship between temperature rise, cross-sectional area, and the maximum current a copper trace can safely carry.
Details: Accurate current capacity calculation is crucial for preventing trace overheating, ensuring reliable PCB operation, and meeting safety standards in electronic design.
Tips: Enter temperature rise in °C and cross-sectional area in mil². Both values must be positive numbers for accurate calculation.
Q1: What is the typical temperature rise used in PCB design?
A: Common temperature rise values range from 10°C to 20°C, depending on application requirements and safety margins.
Q2: How do I calculate cross-sectional area?
A: Cross-sectional area = trace width (mils) × copper thickness (oz) × 1.38 (conversion factor for 1 oz copper).
Q3: Does this formula account for external cooling?
A: The formula provides conservative estimates and assumes standard conditions without additional cooling mechanisms.
Q4: Are there limitations to this formula?
A: The formula works best for internal layers and may need adjustment for external layers or special environmental conditions.
Q5: Should derating factors be applied?
A: For critical applications, additional safety margins (derating factors) should be applied to the calculated current capacity.